week 12----last week!!!:)

21.06.2010(Monday)

===============

- Updated SO8 Flat Lead Weekly Yield Monitoring and SO8 Flat Lead Focus Defect for week 24.

- Copied limit of SMA normal devices to SMA special devices by using SYA tool.

22.06.2010(Tuesdday)

================

- On leave.

23.06.2010(Wedneaday)

==================

- On leave.

24.06.2010(Thursday)

================

- Copied limit of SMA normal devices to SMA special devices by using SYA tool.

- Used SYA Tool( Create Ad Hoc Calculator) to update SO8 Flat Lead QA program of machine TESEC351.

25.06.2010(Friday)

==============

- It was my last day of internship!

- Since supervisor did not assigned any work to me, the things I did for today was just settle up all the forms, report and log book......and took photos with colleagues and friends.

- Had a farewell dinner with colleagues and friends and night too!happy!:)

~ Got my last month salary..:)

week 11

14.06.2010(Monday)

==================

- Updated SO8 Flat Lead Yield Loss Monitoring and Focus Defect for week 23.

During the updating process we must always make sure whether there is any new description is added or not. For this week, a new description is added which is Incoming Others Wafer Rejects(QT).

- Updated current IRS PAT limit to proposed max limit and generated report for the updating.

Steps:

------

(a) Download 6 Bin Program from FET_PPD_SMB_6BIN program.

(b) Upload the propsed limit by using Concurrent DOS PC.

(c) Check in the uploaded program into the program in FET_PPD_SMB.

(D) Done and update the latest version of the program in MS Excel.

15.06.2010(Tuesday)

===================

- Continued updating IRS PAT max limit.

- Measured and calculated no. of void, area of die and percentage of voided area of the X-ray

photos taken.

percentage of voided area = (no. of void/ area of die) x 100%

- Recorded RG readings for lot P018S8K00Q and P018S8K00P. 10 readings for each lot are taken where the min limit must be 2.30 ohm.

*RG readings is the resistance of the die.

16.06.2010(Wednesday)

=====================

- Updated IRS PAT max limit for SMB AT3 devices. The days before were updated for AT3G devices.

- Learned to use Statistical Yield Analysis(SYA) tool to copy approved limit selection.

*SYA Tool is used to double confirmed that there is no error occured in the updated program

to avoid problem occuring when running a production.

- Checked whether a lot has been retest or not by using "newtON STDF" program.

Steps:

------

(a) Login to "newtON STDF".

(b) Type the lot number in the "Lot" column and click on "Search" button.

(c) List of program is shown.

(d) If there are only 3 programs are listed, it means that the lot has not been retested.

(f) If there are 6 programs listed, the lot has been retested.

*3 programs represented 3 tested stations of the tester which are FT, QA and RG.

17.06.2010(Thursday)

====================

- Converted general format limit(IR, VR, VFP, DVR, DIR, VFS and IRS) to scientific format limit for device SBRS8140T3G.

e.g. 21.080uA ==> 2.11E-05

224.64pF ==> 2.2464E-10

- Used SYA Tool to copy approved limit for particular SZ devices.

18.06.2010(Friday)

==================

- Used SYA Tool to copy limit of normal SMA devices to SMA special devices.(Characterization).

week 10

07.06.2010(Monday)
==================
- Replacement holiday for Agong's birthday..:)

08.06.2010(Tuesday)
===================
- Updated SO8 Flat Lead Yield Loss Monitoring and Focus Defect for week 22.
- Uploaded VFP min limit = 0.2 for SMB SZ devices.

09.06.2010(Wednesday)
=====================
- Continued upload VFP min limit = 0.2 for SMB SZ devices.
- Uploaded VFP min limit = 0.2 for SMB normal devices.

10.06.2010(Thursday)
====================
- Recorded standoff readings for powermite machince. Machine numbers: Q2, Q17, Q19, Q20 and Q25.
Recorded 100 readings for each machine.
- Continued upload VFP min limit = 0.2 for SMB normal devices.

11.06.2010(Friday)
==================
- Continued upload VFP min limit = 0.2 for SMB normal devices.
- Explanation on the use of Statistical Yield Analysis(SYA) tool by assistant supervisor.

~ Overall, this week focused on uploading VFP min limit for SMB devices because the due
date was near..:D

week 9

31.05.2010(Monday)
==================
- Updated SO8 Flat Lead Weekly Yield Monitoring and Focus Defect for week 21.
- Updated Front End, Back End and Final Test yield loss for 8 types of packages for May 2010.
- Updated GRR and bias study for machine P41 and P1.

* Bias study is testing a unit for few times by using the same machine and see how much the
difference(biasing) between the readings recorded.

01.06.2010(Tuesday)
===================
- Continued Update Front End, Back End and Final Test yield loss for 8 types of packages for May 2010.
- Prepared and reviewed the presentation slides with supervisor for internship lecturer visiting.
- Lecturer visiting: 4.00pm - 4.45pm

02.06.2010(Wednesday)
=====================
- Updated GRR, Bias study, Linearity and Stability for machine of type 881. (limit updated:VDSON).
- Learned how to do mapping.
- Continued Update Front End, Back End and Final Test yield loss for 8 types of packages for May 2010.
- Updated Linearity and Stability for machince P36(FT2 and QA).

03.06.2010(Thursday)
====================
- Updated VFP min limit = 0.2 for SMB devices.
- An Excel file was downloaded after the mapping process done yesterday. So, today I needed to
update machine name, final test output quantity, final test yield loss percentage, PAT_LKG
limit for SAW, DIE BOND and FINAL TEST processes in the Excel file.

04.06.2010(Friday)
==================
- Updated IRS current max limit to proposed limit for SMA devices.
- Continued upload VFP min limit = 0.2 for SMB devices.

week 8

24.05.2010(Monday)

===============

- Arranged the lots in technical room, copied down the device name, lot number and how many box of lot found for each lot number.

- Searched for the total quantity for each lot in Genesis website.

- Updated SO8 Flat Lead Focus Defect and SO8 Flat Lead yield monitoring for week 20.

- Updated GRR and Bias Study for machine Q36(QA).

- Updated VFP min limit =0.2 for SMC_AT_6BIN package.

25.05.2010(Tuesday)

===============

- Searched for lot SBP017S8K033 in scheduling room and passed it to engineer.

- Recorded the standoff readings for Powermite(lot no: P012PMG2Y) in production line.

Device Name: PowerMite

(picture taken from Google)

* Standoff reading for vision spec is in between -1.9 --> 3 mil. Smaller or greater than the range may caused customer return!

- Uploaded VFP min limit = 0.2 for SMB package and generated report for it.

26.05.2010(Wednesday)

=================

- Uploaded VFP min limit = 0.2 for SMC_AT_6BIN program.

- Edited the program(the range of max and min limit) of FT2 and QA for u8Flat Lead device in newton.onsemi.com website by using the Editor.exe software.

~ Got my second month salary today!^^

27.05.2010(Thursday)

================

- Uploaded VFP min limit = 0.2 and generated report for SMB package.

- Rechecked the sealing temperature, sealing pressure(Bar) and peel force(gms) for logs for specific package and machine.

28.05.2010(Friday)

==============

- Public Holiday!!(Wesak Day)..:)

week 7

17.05.2010(Monday)

===============

- Updated SO8 Flat Lead Focus Defect and SO8 Flat Lead weekly yield monitoring for week 19.

- Uploaded VFP min limit = 0.2 for SMA package.

18.05.2010(Tuesday)

===============

- Uploaded VFP min limit = 0.2 for SMA package.

- Uploaded VFP min limit = 0.2 for SMC package.

- Learned how to use ad hoc calculator.

19.05.2010(Wednesday)

=================

- Uploaded VFP min limit = 0.2 for SMC package.

- Reformatted the floppy disk and checked whether it is corrupted.

20.05.2010(Thursday)

=================

- Uploaded VFP min limit = 0.2 for SMC package.

- Uploaded VFP min limit = 0.2 for SMC_AT_6BIN package.

- Reformatted all the floppy disks and checked whether they are corrupted or not.

- Learned how to access to sbn.onsemi.com website to get the soft copy of process specification.

21.05.2010(Friday)

==============

- Uploaded VFP min limit = 0.2 for SMC_AT_6BIN package.

- Searched for device NTMFS4837NHT1G in production line where the quantity of unit must be at least 10K and passed it to supervisor.

- Asked for operator's help to cut off 200 tested and reeled unit from device:

@ NTTFSC4821NTAG

@ NTTFSC4823NTAG

- Checked, compared and edited the saved program(the parameters) for few devices.

* Usually what to edit is the range between the min and max limit for specific item where the range must be tighter than the actual range.

- Updated Gage Repeatability and Reproducibility(GRR) Date Sheet variable data result in the template provided for machine Q5 and Q36.

~ I learned the term "repeatability" in Fundamentals of SE class..:D

week 6

10.05.2010(Monday)

===============

- Replacement holiday for Labour Day..:)

11.05.2010(Tuesday)

===============

- Updated SO8Flat Lead Focus Defect and weekly Yield monitoring for week 18.

- Uploaded IR/IRS(calculated new max limit) for SMB 6BIN program.

12.05.2010(Wednesday)

===============

- Uploaded VFP min limit = 0.2 for SMB package.

- Updated current VZ parameter for test program to new parameter with 5% GB.

13.05.2010(Thursday)

=================

- Uploaded VFP min limit = 0.2 for SMA package.

- Uploaded VFP min limit = 0.2 for and generated report for SMB package.

- Learned how to access to sbn.onsemi.com website to search for final test specification.

- Printed and compiled the device specification documentations.

14.05.2010(Friday)

==============

- Run lot NTTFSC4821NTAG(micro8) in machine Q24 and collected all the rejected unit.

- Updated the latest 6S and Count for IRS REPAT in MS Excel.

- Uploaded VFP min limit = 0.2 for SMA package.

week 5

03.05.10(Monday)

=============

- Learned how to identify good and rejected Powermite package.

- Updated percentage of yield loss of front end, back end and final test of 8 types of packages for April 2010.

- Analyzed shop order.

04.04.10(Tuesday)

=============

- Continued update percentage of yield loss of front end, back end and final test for April 2010.

- Learned how to use "macros" in MS Excel to get the maximum limit and 6S value of package and then updated them into table.

- Searched for wafer lot number through http://mboi.onsemi.com website.

05.05.10(Wednesday)

================

- Uploaded VFP min limit=0.2 and generated report for SMB package.

06.05.10(Thursday)

==============

- Analyzed shop order summary.

- Identified the features of package SMA, SMB, SMC, SO8 Flat Lead, Micro8 Flat Lead, and Powermite.

- Verified and serialized 20 units and recorded down their resistance where the resistance must more than the minimum limit 2.0 ohm.

- Verified 50 units from lot 4939 and serialized them where the Vth is <1.60>

- Verified unit for lot 4833 and 4943 and separated them into different category.

07.05.10(Friday)

============

- Verified lot 4833_25167B and separated the units into different category such as ICES and ISGS.

- Verified 30 units for lot 4939 and serialized them where the Vth is <1.60v.

- Verified 30 units for lot 4935 and serialized them where the Vth is <1.580v.

week 4

26.04.10(Monday)

=============

- Checked and updated the VFP min limit and 6 Bin of FT2 and QA for SMB package.

- Uploaded VFP min limit = 0.2 for SMA package.

- Uploaded VFP min limit = 0.2 for SOD123 Flat Lead package.

*6 Bin is actually a program that can identify what is the cause of rejection of the particular die.

27.04.10(Tuesday)

=============

- Continued upload VFP min limit for SOD123 Flat Lead package.

- Tested and verified the rejected SO8 Flat Lead unit.

- Learned the formula to find pass yield and fail yield percentage.

pass yield =(no. of good unit/no. of tested unit) x 100%

fail yield =(no. of bad unit/no. of tested unit) x 100%

- Learned how to analyze the summary for shop order.

- Uploaded the Maverick Lot Trend from January until April for 8 types of packages stated in previous post.

28.04.10(Wednesday)

===============

- Analyzed the shop order summary.

- Verified and serialized the rejected unit.

* serialize means have to write number on the tested unit by followed the testing sequence.

- Arranged the lot in production line according to the MPN number and lot number.

- Uploaded the 6 bin program and VFP min limit = 0.2 for FT2 of SMB package.

- Uploaded the VFP min limit for QA of SMB package.

29.04.10(Thursday)

==============

- Analyzed the shop order summary.

- Verified 10 units of rejected SO8 Flat Lead.

- Explanation of the X-ray photos of die by supervisor.

- Measured the area of die and total number of void with referred to the X-ray photos taken.

* void is the bubbles(air) in the glue between the die and the mold.

- Took 30 readings of top package and 30 readings of bottom package for machine Q30 and Q33.

Examples of readings included left lead width, right lead width, lead length and etc.

30.04.10(Friday)

============

- Uploaded VFP min limit = 0.2 for SMA package.

- Uploaded VFP min limit = 0.2 for SMB package.

- Tested and verified 10 units of rejected SO8 Flat Lead in machine Q40. Saved the data(.dta) and converted it into .csv file.

- Measured the area of die and total number of void for lot 4833.

# End of one month of training and finally got the first month salary..^^ #

week 3

19.04.2010(Monday)

===============

-Updated the version of each uploaded FT2 and QA folder in MS Excel.

-Monitored handler in production line.

-Updated the lot number, wafer lot number, percentage of yield, Iratio and number of shipped units in MS Excel.

20.04.2010(Tuesday)

===============

-Checked and updated the VFP min limit and 6 Bin of FT2 and QA for SOD123 Flat Lead package.

-Checked and updated the VFP min limit and 6 Bin of FT2 and QA for SMB package.

21.04.2010(Wednesday)

=================

-Checked and updated the VFP min limit and 6 Bin of FT2 and QA for SMB package(continued yesterday's work).

22.04.2010(Thursday)

================

-Orientation from 8.30am to 3.00pm.

-Continued Wednesday's work again.

23.04.2010(Friday)

==============

-Submitted trainee time sheet to HR.

-Uploaded data for SOD123 Flat Lead using DOS.

-Helped supervisor to take vision photo for SOD123 Flat Lead and SenseFET packages.

-Uploaded number of lead mold flash, heatsink mold flash and over reject for the photoes taken.

*End of third week*

3rd, 4th and 5th day of second week

14.04.2010(Wednesday)

==================

I had continued the data updating for yield lost Pkg for year 2010 as what I didn't finished it on Tuesday.

Besides that, I helped to upload the data for the SMB devices. I learned the ways for program testing. It is not very difficult because the program template was already there. I just needed to insert and upload the data.

Added VFP min limit and IRS PAT for FT2 folder and added VFP min limit for QA folder.

14.04.2010(Thursday)

================

Did data updating also for today. This time was update the reject category by final test for Mac. Normally I'm doing some easy jobs such as updating the data into MS Excel as other jobs may be too heavy for me.

After lunch time I went to production line with a colleague, Mr. Yeng and helped him in measure the length of x-dimension and y-dimension of the chips. I needed to take 30 readings for each chip. It took me around 3 hours to finish it.

After that, I went back to office and continued data uploading for test program.

16.04.2010(Friday)

==============

Today is just insert yesterday's measurements into MS Excel and did data uploading again for test program. After finished the task, I helped another colleague, Mr. Yong to check the version of each FTA and QA folder for every uploaded SMB device and then key in the data in MS Excel.

Since the task is not that urgent, my supervisor, Mr. Ooi asked me to go production line with him and he taught me how to operate the handler. Many steps need to be taken and I got confused. Luckily there are some technicians and operators that willing to help and teach me.

Handler is actually the machine used for reeling the die(e.g. SO8 Flat Lead and SenceFET). Mr. Ooi said that i need to know how to operate it although I am a Computer Science student in case in future I might be work in a semiconductor company. Therefore, I just followed and copy down the instructions.

The place i doing my industrial training. -ON Semiconductor-

12.04.2010(Monday)

===============

I learned program testing by using concurrent DOS operating system. The program testing is actually wanted to change the parameter of VF/VFP of the devices to minimum limit= 0.2. The functions of the DOS are change the parameter, update sort parameter, update program run and etc. The process engineer, Mr. Muzhafar had taught me the commands for the specific functions. I was slow at the beginning but then i getting more familiar with it after few updating steps were done.

The examples of commands used:

PT- Enter the name of the test file which is with .TES extension

PR- Enter the name of the run file which is with .RUN extension

UP- Update priority with sort changes

Ctrl Z- To exit the execution of the program

The data is stored in diskette. Since program testing have to use two computers, therefore i need to eject and insert the diskette into both computers alternatively. It took time because there are many files waiting for me to update.

13.04.2010(Tuesday)

===============

I did data upload for today. I need to browse the SMB folder and check whether the value of the VF/VFP has been changed or not.

Besides that, I had learned 8 types of semiconductor package that produced by my department(Department of Power Products Division). There are:

- SMA(YE)
- SMB(Y4)

- SMC(Y5)

- PMITE(PM)

- SOD123(YB)

- SO8(TR)

- u8FL(IF)

- SFET(CU)

I will update the details for each package later. After that, I had updated the percentage of yield loss for each package in the MS Excel. In addtion, Mdm. CC Lim also explained some of the process of the machines to me.

the flat leads..........and the microscope

*4th day*

As usual, i helped my supervisor in production line.

Today's job was separated the good flat leads and the rejected flat leads.

Besides that, he also explained the functions of the machines to me and also the reasons why they designed the machine like that.

I had learned something about the semiconductor tester and handler.

Although it was more to E&E field, but it was not bad at least i got some extra knowledge.

*5th day*

Today is the end of the first week of internship.

Today is nothing much to do. My team mate gave me some notes on program testing for me to read and understand it. It is something like Linux.

Besides that, another team mate taught me how to test the program. It looked interesting but his demo was too fast, I can't really catch up. Have to ask him again next week.

Since today is Friday, the cafe is closed during lunch time. So, the friends in my department asked me to join them for the lunch. The "boss" treated us for the lunch and we joked around. He is really nice and funny.

I had knew more friends in my department today. They all are very nice.=)

first post for internship post

I have been informed through e-mail today where all COIT students all required to create a blog for the internship as what COE students did.

------------------------------------------------

Details of my intership:

- company's name: ON semiconductor

- address: SCG Industries Malaysia Sdn Bhd.

Lot 122, Senawang Industrial Estate,

70450 Seremban, Negeri Sembilan.

- tel: 06-677 3088

- host supervisor: Mr. Ooi Chong Seng

-----------------------------------------------

Well, normally there was nothing to do for the first day. After surrounded the company guided by my supervisor, I was just sit in front of computer and doing my own thing. It was so bored because all of my team mates were busy with their works in lab or we called it as production line.

For the second day, I just helped my team mates to do some simple works by using MS Excel.

Today is the third day. Finally i got something to do. I helped my supervisor in production line.

The jobs were separated the flat lead into few categories. Since the leads are too small, I have to see it by using microscope. It has been aged I didn't used microscope. It was fun. Then, controlled and observed the machine/system to avoid system breakdown.

Overall, today is quite busy but it is better than nothing to do..=)