week 8

24.05.2010(Monday)

===============

- Arranged the lots in technical room, copied down the device name, lot number and how many box of lot found for each lot number.

- Searched for the total quantity for each lot in Genesis website.

- Updated SO8 Flat Lead Focus Defect and SO8 Flat Lead yield monitoring for week 20.

- Updated GRR and Bias Study for machine Q36(QA).

- Updated VFP min limit =0.2 for SMC_AT_6BIN package.

25.05.2010(Tuesday)

===============

- Searched for lot SBP017S8K033 in scheduling room and passed it to engineer.

- Recorded the standoff readings for Powermite(lot no: P012PMG2Y) in production line.

Device Name: PowerMite

(picture taken from Google)

* Standoff reading for vision spec is in between -1.9 --> 3 mil. Smaller or greater than the range may caused customer return!

- Uploaded VFP min limit = 0.2 for SMB package and generated report for it.

26.05.2010(Wednesday)

=================

- Uploaded VFP min limit = 0.2 for SMC_AT_6BIN program.

- Edited the program(the range of max and min limit) of FT2 and QA for u8Flat Lead device in newton.onsemi.com website by using the Editor.exe software.

~ Got my second month salary today!^^

27.05.2010(Thursday)

================

- Uploaded VFP min limit = 0.2 and generated report for SMB package.

- Rechecked the sealing temperature, sealing pressure(Bar) and peel force(gms) for logs for specific package and machine.

28.05.2010(Friday)

==============

- Public Holiday!!(Wesak Day)..:)

week 7

17.05.2010(Monday)

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- Updated SO8 Flat Lead Focus Defect and SO8 Flat Lead weekly yield monitoring for week 19.

- Uploaded VFP min limit = 0.2 for SMA package.

18.05.2010(Tuesday)

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- Uploaded VFP min limit = 0.2 for SMA package.

- Uploaded VFP min limit = 0.2 for SMC package.

- Learned how to use ad hoc calculator.

19.05.2010(Wednesday)

=================

- Uploaded VFP min limit = 0.2 for SMC package.

- Reformatted the floppy disk and checked whether it is corrupted.

20.05.2010(Thursday)

=================

- Uploaded VFP min limit = 0.2 for SMC package.

- Uploaded VFP min limit = 0.2 for SMC_AT_6BIN package.

- Reformatted all the floppy disks and checked whether they are corrupted or not.

- Learned how to access to sbn.onsemi.com website to get the soft copy of process specification.

21.05.2010(Friday)

==============

- Uploaded VFP min limit = 0.2 for SMC_AT_6BIN package.

- Searched for device NTMFS4837NHT1G in production line where the quantity of unit must be at least 10K and passed it to supervisor.

- Asked for operator's help to cut off 200 tested and reeled unit from device:

@ NTTFSC4821NTAG

@ NTTFSC4823NTAG

- Checked, compared and edited the saved program(the parameters) for few devices.

* Usually what to edit is the range between the min and max limit for specific item where the range must be tighter than the actual range.

- Updated Gage Repeatability and Reproducibility(GRR) Date Sheet variable data result in the template provided for machine Q5 and Q36.

~ I learned the term "repeatability" in Fundamentals of SE class..:D

week 6

10.05.2010(Monday)

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- Replacement holiday for Labour Day..:)

11.05.2010(Tuesday)

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- Updated SO8Flat Lead Focus Defect and weekly Yield monitoring for week 18.

- Uploaded IR/IRS(calculated new max limit) for SMB 6BIN program.

12.05.2010(Wednesday)

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- Uploaded VFP min limit = 0.2 for SMB package.

- Updated current VZ parameter for test program to new parameter with 5% GB.

13.05.2010(Thursday)

=================

- Uploaded VFP min limit = 0.2 for SMA package.

- Uploaded VFP min limit = 0.2 for and generated report for SMB package.

- Learned how to access to sbn.onsemi.com website to search for final test specification.

- Printed and compiled the device specification documentations.

14.05.2010(Friday)

==============

- Run lot NTTFSC4821NTAG(micro8) in machine Q24 and collected all the rejected unit.

- Updated the latest 6S and Count for IRS REPAT in MS Excel.

- Uploaded VFP min limit = 0.2 for SMA package.

week 5

03.05.10(Monday)

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- Learned how to identify good and rejected Powermite package.

- Updated percentage of yield loss of front end, back end and final test of 8 types of packages for April 2010.

- Analyzed shop order.

04.04.10(Tuesday)

=============

- Continued update percentage of yield loss of front end, back end and final test for April 2010.

- Learned how to use "macros" in MS Excel to get the maximum limit and 6S value of package and then updated them into table.

- Searched for wafer lot number through http://mboi.onsemi.com website.

05.05.10(Wednesday)

================

- Uploaded VFP min limit=0.2 and generated report for SMB package.

06.05.10(Thursday)

==============

- Analyzed shop order summary.

- Identified the features of package SMA, SMB, SMC, SO8 Flat Lead, Micro8 Flat Lead, and Powermite.

- Verified and serialized 20 units and recorded down their resistance where the resistance must more than the minimum limit 2.0 ohm.

- Verified 50 units from lot 4939 and serialized them where the Vth is <1.60>

- Verified unit for lot 4833 and 4943 and separated them into different category.

07.05.10(Friday)

============

- Verified lot 4833_25167B and separated the units into different category such as ICES and ISGS.

- Verified 30 units for lot 4939 and serialized them where the Vth is <1.60v.

- Verified 30 units for lot 4935 and serialized them where the Vth is <1.580v.

week 4

26.04.10(Monday)

=============

- Checked and updated the VFP min limit and 6 Bin of FT2 and QA for SMB package.

- Uploaded VFP min limit = 0.2 for SMA package.

- Uploaded VFP min limit = 0.2 for SOD123 Flat Lead package.

*6 Bin is actually a program that can identify what is the cause of rejection of the particular die.

27.04.10(Tuesday)

=============

- Continued upload VFP min limit for SOD123 Flat Lead package.

- Tested and verified the rejected SO8 Flat Lead unit.

- Learned the formula to find pass yield and fail yield percentage.

pass yield =(no. of good unit/no. of tested unit) x 100%

fail yield =(no. of bad unit/no. of tested unit) x 100%

- Learned how to analyze the summary for shop order.

- Uploaded the Maverick Lot Trend from January until April for 8 types of packages stated in previous post.

28.04.10(Wednesday)

===============

- Analyzed the shop order summary.

- Verified and serialized the rejected unit.

* serialize means have to write number on the tested unit by followed the testing sequence.

- Arranged the lot in production line according to the MPN number and lot number.

- Uploaded the 6 bin program and VFP min limit = 0.2 for FT2 of SMB package.

- Uploaded the VFP min limit for QA of SMB package.

29.04.10(Thursday)

==============

- Analyzed the shop order summary.

- Verified 10 units of rejected SO8 Flat Lead.

- Explanation of the X-ray photos of die by supervisor.

- Measured the area of die and total number of void with referred to the X-ray photos taken.

* void is the bubbles(air) in the glue between the die and the mold.

- Took 30 readings of top package and 30 readings of bottom package for machine Q30 and Q33.

Examples of readings included left lead width, right lead width, lead length and etc.

30.04.10(Friday)

============

- Uploaded VFP min limit = 0.2 for SMA package.

- Uploaded VFP min limit = 0.2 for SMB package.

- Tested and verified 10 units of rejected SO8 Flat Lead in machine Q40. Saved the data(.dta) and converted it into .csv file.

- Measured the area of die and total number of void for lot 4833.

# End of one month of training and finally got the first month salary..^^ #