week 3

19.04.2010(Monday)

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-Updated the version of each uploaded FT2 and QA folder in MS Excel.

-Monitored handler in production line.

-Updated the lot number, wafer lot number, percentage of yield, Iratio and number of shipped units in MS Excel.

20.04.2010(Tuesday)

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-Checked and updated the VFP min limit and 6 Bin of FT2 and QA for SOD123 Flat Lead package.

-Checked and updated the VFP min limit and 6 Bin of FT2 and QA for SMB package.

21.04.2010(Wednesday)

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-Checked and updated the VFP min limit and 6 Bin of FT2 and QA for SMB package(continued yesterday's work).

22.04.2010(Thursday)

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-Orientation from 8.30am to 3.00pm.

-Continued Wednesday's work again.

23.04.2010(Friday)

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-Submitted trainee time sheet to HR.

-Uploaded data for SOD123 Flat Lead using DOS.

-Helped supervisor to take vision photo for SOD123 Flat Lead and SenseFET packages.

-Uploaded number of lead mold flash, heatsink mold flash and over reject for the photoes taken.

*End of third week*

3rd, 4th and 5th day of second week

14.04.2010(Wednesday)

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I had continued the data updating for yield lost Pkg for year 2010 as what I didn't finished it on Tuesday.

Besides that, I helped to upload the data for the SMB devices. I learned the ways for program testing. It is not very difficult because the program template was already there. I just needed to insert and upload the data.

Added VFP min limit and IRS PAT for FT2 folder and added VFP min limit for QA folder.

14.04.2010(Thursday)

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Did data updating also for today. This time was update the reject category by final test for Mac. Normally I'm doing some easy jobs such as updating the data into MS Excel as other jobs may be too heavy for me.

After lunch time I went to production line with a colleague, Mr. Yeng and helped him in measure the length of x-dimension and y-dimension of the chips. I needed to take 30 readings for each chip. It took me around 3 hours to finish it.

After that, I went back to office and continued data uploading for test program.

16.04.2010(Friday)

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Today is just insert yesterday's measurements into MS Excel and did data uploading again for test program. After finished the task, I helped another colleague, Mr. Yong to check the version of each FTA and QA folder for every uploaded SMB device and then key in the data in MS Excel.

Since the task is not that urgent, my supervisor, Mr. Ooi asked me to go production line with him and he taught me how to operate the handler. Many steps need to be taken and I got confused. Luckily there are some technicians and operators that willing to help and teach me.

Handler is actually the machine used for reeling the die(e.g. SO8 Flat Lead and SenceFET). Mr. Ooi said that i need to know how to operate it although I am a Computer Science student in case in future I might be work in a semiconductor company. Therefore, I just followed and copy down the instructions.

The place i doing my industrial training. -ON Semiconductor-

12.04.2010(Monday)

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I learned program testing by using concurrent DOS operating system. The program testing is actually wanted to change the parameter of VF/VFP of the devices to minimum limit= 0.2. The functions of the DOS are change the parameter, update sort parameter, update program run and etc. The process engineer, Mr. Muzhafar had taught me the commands for the specific functions. I was slow at the beginning but then i getting more familiar with it after few updating steps were done.

The examples of commands used:

PT- Enter the name of the test file which is with .TES extension

PR- Enter the name of the run file which is with .RUN extension

UP- Update priority with sort changes

Ctrl Z- To exit the execution of the program

The data is stored in diskette. Since program testing have to use two computers, therefore i need to eject and insert the diskette into both computers alternatively. It took time because there are many files waiting for me to update.

13.04.2010(Tuesday)

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I did data upload for today. I need to browse the SMB folder and check whether the value of the VF/VFP has been changed or not.

Besides that, I had learned 8 types of semiconductor package that produced by my department(Department of Power Products Division). There are:

- SMA(YE)
- SMB(Y4)

- SMC(Y5)

- PMITE(PM)

- SOD123(YB)

- SO8(TR)

- u8FL(IF)

- SFET(CU)

I will update the details for each package later. After that, I had updated the percentage of yield loss for each package in the MS Excel. In addtion, Mdm. CC Lim also explained some of the process of the machines to me.

the flat leads..........and the microscope

*4th day*

As usual, i helped my supervisor in production line.

Today's job was separated the good flat leads and the rejected flat leads.

Besides that, he also explained the functions of the machines to me and also the reasons why they designed the machine like that.

I had learned something about the semiconductor tester and handler.

Although it was more to E&E field, but it was not bad at least i got some extra knowledge.

*5th day*

Today is the end of the first week of internship.

Today is nothing much to do. My team mate gave me some notes on program testing for me to read and understand it. It is something like Linux.

Besides that, another team mate taught me how to test the program. It looked interesting but his demo was too fast, I can't really catch up. Have to ask him again next week.

Since today is Friday, the cafe is closed during lunch time. So, the friends in my department asked me to join them for the lunch. The "boss" treated us for the lunch and we joked around. He is really nice and funny.

I had knew more friends in my department today. They all are very nice.=)

first post for internship post

I have been informed through e-mail today where all COIT students all required to create a blog for the internship as what COE students did.

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Details of my intership:

- company's name: ON semiconductor

- address: SCG Industries Malaysia Sdn Bhd.

Lot 122, Senawang Industrial Estate,

70450 Seremban, Negeri Sembilan.

- tel: 06-677 3088

- host supervisor: Mr. Ooi Chong Seng

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Well, normally there was nothing to do for the first day. After surrounded the company guided by my supervisor, I was just sit in front of computer and doing my own thing. It was so bored because all of my team mates were busy with their works in lab or we called it as production line.

For the second day, I just helped my team mates to do some simple works by using MS Excel.

Today is the third day. Finally i got something to do. I helped my supervisor in production line.

The jobs were separated the flat lead into few categories. Since the leads are too small, I have to see it by using microscope. It has been aged I didn't used microscope. It was fun. Then, controlled and observed the machine/system to avoid system breakdown.

Overall, today is quite busy but it is better than nothing to do..=)